Molded electronic device

The invention discloses a molded electronic device. The molded electronic device comprises a bent substrate, a first circuit layer, a dielectric layer, a segment difference compensation layer and a second circuit layer. The curved substrate has a first surface. The first circuit layer is arranged on the first surface. The dielectric layer is disposed on the first circuit layer and has a first thickness. The segment difference compensation layer is arranged on the first surface and is connected with the dielectric layer. The segment difference compensation layer has a second thickness. The second circuit layer is arranged on the segment difference compensation layer and is electrically connected with the segment difference compensation layer. The curvature radius of the bent substrate is c, the ratio of the second thickness to the first thickness is r, and c and r meet the relational expression that r = 1.5-0.02 c +/-15%. 本发明公开一种模塑电子装置。模塑电子装置包括弯曲基板、第一线路层、介电层、段差补偿层以及第二线路层。弯曲基板具有第一表面。第一线路层设置于第一表面上。介电层设置于第一线路层上且具