High-uniformity low-substrate damage surface selective metallization process

The invention provides a selective metallization process for a high-uniformity low-substrate-damage surface. The selective metallization process comprises the following steps: S1, mixing metal salt, a complexing agent and a solvent to prepare an ink precursor; s2, carrying out patterning printing treatment on the printing ink precursor on a substrate, and drying the printing ink precursor at 50-80 DEG C for 5-15 minutes to obtain a solid printing ink pattern; and S3, carrying out post-treatment metallization on the solid ink pattern through an ultrafast laser post-treatment process to obtain a metal micro-pattern structure. The printing ink precursor is subjected to patterning treatment, the liquid printing ink precursor is promoted to be prepared into a uniform solid printing ink patterned film, surface selective metallization treatment is carried out by adopting an ultrafast laser post-treatment process, and a light beam shaping technology is combined to achieve a synergistic effect with patterned printing