Side wall manufacturing method and device, chip and electronic equipment

The invention provides a side wall manufacturing method and device, a chip and electronic equipment, and the method comprises the steps: adding at least one layer of intermediate material, the light transmittance of which is lower than that of a second layer of material, between a light-proof first...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PENG XIONG, CHEN HEDAN, YAO YEWANG, TIAN YE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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