Side wall manufacturing method and device, chip and electronic equipment

The invention provides a side wall manufacturing method and device, a chip and electronic equipment, and the method comprises the steps: adding at least one layer of intermediate material, the light transmittance of which is lower than that of a second layer of material, between a light-proof first layer of material and a light-transmitting second layer of material of a photomask of a passivation protection layer; adjusting a first length of the first layer of material and a second length of the intermediate material according to chip function requirements, combining the first layer of material and the intermediate material to obtain a plurality of photomask sub-structures, and arranging the plurality of photomask sub-structures to obtain a target photomask structure; photoetching and manufacturing a passivation layer of a semiconductor chip by using the target photomask structure, and respectively performing etching and photoresist removal on the semiconductor chip to obtain various chip passivation layer si