Electromigration process simulation method and system combined with atom evolution information and electronic equipment

The invention discloses an electro-migration process simulation method and system combined with atom evolution information and electronic equipment, and aims to overcome the defect that a traditional simulation method is difficult to describe cavity growth and expansion phenomena in electro-migration (EM) in the service process of an electronic packaging device, and the simulation method is combined with a finite element simulation method (FEM), and the temperature and density information files are identified to simulate the electro-migration process of the electronic packaging device. Atomic stress information is calculated by adopting an iterative algorithm, and atomic evolution information after iterative solution is obtained by utilizing visual software. The method gets rid of the tedious limitation of a mathematical method for solving the atomic concentration through a mass flux differential equation, atom evolution in the electromigration process is simulated through molecular dynamics (MD), and a theor