Drying device and top knife thereof
The invention discloses a drying device and a top cutter thereof. The top cutter comprises a top cutter body. A fixing structure, used for being matched with a wafer, of the top cutter body is of an axial symmetry structure and is at least used for providing two symmetrical supports for the wafer. A...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a drying device and a top cutter thereof. The top cutter comprises a top cutter body. A fixing structure, used for being matched with a wafer, of the top cutter body is of an axial symmetry structure and is at least used for providing two symmetrical supports for the wafer. A drainage structure is arranged at the lowest position of the fixing structure and penetrates through the side wall of the top cutter body. According to the scheme, on one hand, the fixing structure is arranged to be of an axial symmetry structure so that two symmetrical supports can be provided for the wafer, the wafer is in a vertical and stable state when being supported, and the wafer is prevented from making contact with the cleaning basket; therefore, the deionized water can be discharged when flowing downwards to the lowest position of the fixing structure, accumulation is avoided, the deionized water flowing to the edge of the bottom of the wafer can be rapidly separated from the wafer, watermarks or white |
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