Selective plating process capable of combining multiple metal materials to chip on film
The invention discloses a selective plating process capable of combining various metal materials to a chip on film, a second electroplating tank is arranged on the right side of a first electroplating tank in parallel, servo motors are fixed on the back surfaces of the bottoms of two sides of a brac...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | CHEN JIUTANG JIANG ZUPING SUN MANHUI |
| description | The invention discloses a selective plating process capable of combining various metal materials to a chip on film, a second electroplating tank is arranged on the right side of a first electroplating tank in parallel, servo motors are fixed on the back surfaces of the bottoms of two sides of a bracket, and a transmission rod is arranged at the bottom of one side, far away from an electric push rod, of an oil liquid box in a penetrating manner; the bottom of the transmission rod is provided with a limiting rubber wheel shaft, and a flexible circuit board is arranged between the rubber shafts which are distributed up and down in a penetrating mode. The film clamping assembly is matched with movement of the conveying sliding rail to achieve assembly line automatic electroplating operation on the flexible circuit board to be electroplated; and different parts of the flexible circuit board are electroplated by adopting different metals in the electroplating process in the moving process, and adaptive metals are s |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117626392A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117626392A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117626392A3</originalsourceid><addsrcrecordid>eNqNijEKwkAQAK-xEPUP6wMskkDEUoJiZaNgGTbHnlnYu1tyq-83gg-wGpiZpXvcSMgbvwlU0Dg9QafsqRTwqDgIQQ7gcxw4fWN8ibHONpKhQESjiVEKWAY_skJOEFji2i3CrGnz48ptz6d7d9mR5p6KoqdE1nfXqtq3ddsc6mPzz_MBceo5-g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Selective plating process capable of combining multiple metal materials to chip on film</title><source>esp@cenet</source><creator>CHEN JIUTANG ; JIANG ZUPING ; SUN MANHUI</creator><creatorcontrib>CHEN JIUTANG ; JIANG ZUPING ; SUN MANHUI</creatorcontrib><description>The invention discloses a selective plating process capable of combining various metal materials to a chip on film, a second electroplating tank is arranged on the right side of a first electroplating tank in parallel, servo motors are fixed on the back surfaces of the bottoms of two sides of a bracket, and a transmission rod is arranged at the bottom of one side, far away from an electric push rod, of an oil liquid box in a penetrating manner; the bottom of the transmission rod is provided with a limiting rubber wheel shaft, and a flexible circuit board is arranged between the rubber shafts which are distributed up and down in a penetrating mode. The film clamping assembly is matched with movement of the conveying sliding rail to achieve assembly line automatic electroplating operation on the flexible circuit board to be electroplated; and different parts of the flexible circuit board are electroplated by adopting different metals in the electroplating process in the moving process, and adaptive metals are s</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240301&DB=EPODOC&CC=CN&NR=117626392A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240301&DB=EPODOC&CC=CN&NR=117626392A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN JIUTANG</creatorcontrib><creatorcontrib>JIANG ZUPING</creatorcontrib><creatorcontrib>SUN MANHUI</creatorcontrib><title>Selective plating process capable of combining multiple metal materials to chip on film</title><description>The invention discloses a selective plating process capable of combining various metal materials to a chip on film, a second electroplating tank is arranged on the right side of a first electroplating tank in parallel, servo motors are fixed on the back surfaces of the bottoms of two sides of a bracket, and a transmission rod is arranged at the bottom of one side, far away from an electric push rod, of an oil liquid box in a penetrating manner; the bottom of the transmission rod is provided with a limiting rubber wheel shaft, and a flexible circuit board is arranged between the rubber shafts which are distributed up and down in a penetrating mode. The film clamping assembly is matched with movement of the conveying sliding rail to achieve assembly line automatic electroplating operation on the flexible circuit board to be electroplated; and different parts of the flexible circuit board are electroplated by adopting different metals in the electroplating process in the moving process, and adaptive metals are s</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijEKwkAQAK-xEPUP6wMskkDEUoJiZaNgGTbHnlnYu1tyq-83gg-wGpiZpXvcSMgbvwlU0Dg9QafsqRTwqDgIQQ7gcxw4fWN8ibHONpKhQESjiVEKWAY_skJOEFji2i3CrGnz48ptz6d7d9mR5p6KoqdE1nfXqtq3ddsc6mPzz_MBceo5-g</recordid><startdate>20240301</startdate><enddate>20240301</enddate><creator>CHEN JIUTANG</creator><creator>JIANG ZUPING</creator><creator>SUN MANHUI</creator><scope>EVB</scope></search><sort><creationdate>20240301</creationdate><title>Selective plating process capable of combining multiple metal materials to chip on film</title><author>CHEN JIUTANG ; JIANG ZUPING ; SUN MANHUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117626392A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN JIUTANG</creatorcontrib><creatorcontrib>JIANG ZUPING</creatorcontrib><creatorcontrib>SUN MANHUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN JIUTANG</au><au>JIANG ZUPING</au><au>SUN MANHUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Selective plating process capable of combining multiple metal materials to chip on film</title><date>2024-03-01</date><risdate>2024</risdate><abstract>The invention discloses a selective plating process capable of combining various metal materials to a chip on film, a second electroplating tank is arranged on the right side of a first electroplating tank in parallel, servo motors are fixed on the back surfaces of the bottoms of two sides of a bracket, and a transmission rod is arranged at the bottom of one side, far away from an electric push rod, of an oil liquid box in a penetrating manner; the bottom of the transmission rod is provided with a limiting rubber wheel shaft, and a flexible circuit board is arranged between the rubber shafts which are distributed up and down in a penetrating mode. The film clamping assembly is matched with movement of the conveying sliding rail to achieve assembly line automatic electroplating operation on the flexible circuit board to be electroplated; and different parts of the flexible circuit board are electroplated by adopting different metals in the electroplating process in the moving process, and adaptive metals are s</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117626392A |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Selective plating process capable of combining multiple metal materials to chip on film |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T15%3A15%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHEN%20JIUTANG&rft.date=2024-03-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117626392A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |