Selective plating process capable of combining multiple metal materials to chip on film

The invention discloses a selective plating process capable of combining various metal materials to a chip on film, a second electroplating tank is arranged on the right side of a first electroplating tank in parallel, servo motors are fixed on the back surfaces of the bottoms of two sides of a bracket, and a transmission rod is arranged at the bottom of one side, far away from an electric push rod, of an oil liquid box in a penetrating manner; the bottom of the transmission rod is provided with a limiting rubber wheel shaft, and a flexible circuit board is arranged between the rubber shafts which are distributed up and down in a penetrating mode. The film clamping assembly is matched with movement of the conveying sliding rail to achieve assembly line automatic electroplating operation on the flexible circuit board to be electroplated; and different parts of the flexible circuit board are electroplated by adopting different metals in the electroplating process in the moving process, and adaptive metals are s