Low-climbing protective film on red copper foil

The invention discloses a low-climbing protective film on a red copper foil, which belongs to the technical field of protective films and comprises a polyimide film layer and a modified adhesive layer which are sequentially arranged, the adhesive is prepared from the following raw materials in parts by weight: 20 to 35 parts of modified polyol, 11 to 15 parts of olefin isocyanate, 1 to 2 parts of dibutyltin dilaurate serving as a catalyst and 0.5 to 2 parts of triethylamine serving as a chain extender, the modified polyol is prepared by carrying out a sulfhydrylation reaction on 2-aminoresorcinol by adopting 2-imino sulfane hydrochloride. The overall cross-linking density of the modified adhesive layer is greatly improved, when the protective film is stripped after being placed for 7 days at the temperature of 80 DEG C, the binding power of the protective film does not exceed 300% of the initial binding power, and after normal temperature is recovered, the stripping force does not increase too much, and the p