Crystal sectioning device

The invention discloses a special equipment device applied to crystal sectioning of III-V compound semiconductor materials such as InP, GaAs, GaN and SiC. According to the device, the pressure detection mechanism is adopted to control the splitting pressure, the splitting pressure can be accurately detected and controlled, and the horizontal movement mechanism provides horizontal movement so as to realize the positioning of the splitting knife in the horizontal direction. A double-workbench control mode is adopted for vertical movement, a macro-motion table controls vertical movement of a splitting cutter, a micro-motion table achieves accurate control of splitting pressure, the automatic adjusting function of the horizontal angle of the splitting cutter is achieved, the horizontal angle of the splitting cutter is automatically adjusted through an actuator, and the splitting cutter is parallel to the surface of a machined device. The device has the function of adjusting the splitting direction angle of the sp