Bonding device and bonding method for supporting pad on retaining ring

The invention relates to a bonding device and method for a supporting pad on a retaining ring, in particular to the field of mechanochemical grinding equipment, and the bonding device for the supporting pad on the retaining ring comprises a cavity and vacuum equipment connected with the cavity; a retaining ring fixing table, a pressing rod, a cutting device, a supporting pad cutting table and a photographing device are arranged in the cavity. The pressing rod is a movable pressing rod and is used for moving a supporting pad cut by cutting equipment on the supporting pad cutting table to the position above the retaining ring fixing table; the photographing device is connected with the pressing rod through the controller. The cutting equipment is arranged above the supporting pad cutting table; the pressing rod and the cutting equipment are matched in a nested mode. According to the bonding device, the device is reasonably designed, the supporting pad can be bonded in a vacuum environment, the surface of the bo