Welding device

The invention provides a welding device. The welding device comprises a welding cavity module, a flow control module, a bubbling module and a vacuum module. The welding cavity module is connected with the flow control module, the bubbling module and the vacuum module. The welding cavity module is used for welding a semiconductor packaging product; the flow control module and the bubbling module are both connected with a carrier gas source; the flow control module is used for controlling the flow of carrier gas flowing to the welding cavity module; the bubbling module is used for providing mixed gas for the welding cavity module; the components of the mixed gas comprise carrier gas and a carrying source; the vacuum module is used for extracting gas of the welding cavity module so that the welding cavity module can be in a negative pressure state. The device is used for welding semiconductor packaging products. 本发明提供了一种焊接装置，包括：焊接腔模块、流量控制模块、鼓泡模块和真空模块；所述焊接腔模块分别与所述流量控制模块、所述鼓泡模块和所述真空模块连接；所述焊接腔模块用于焊接半导体封装产品；所述流量控制模块