Flexible board with thick base material copper and manufacturing method thereof
The invention discloses a flexible board with thick base material copper and a manufacturing method of the flexible board. The method comprises the following steps: providing a flexible substrate after drilling; the flexible substrate is provided with thick base material copper, and the thickness ra...
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| creator | LIU RUMENG YAO JIMIN ZHAI SHUWEN |
| description | The invention discloses a flexible board with thick base material copper and a manufacturing method of the flexible board. The method comprises the following steps: providing a flexible substrate after drilling; the flexible substrate is provided with thick base material copper, and the thickness range of the thick base material copper is 18-35 microns; according to the first micro-etching parameter, performing primary micro-etching on the flexible substrate, and performing primary chemical cleaning on the flexible substrate after the primary micro-etching to form a first substrate; plating a carbon film on the first substrate based on the second micro-etching parameter and the third micro-etching parameter to form a second substrate; and according to the fourth micro-etching parameter, carrying out secondary micro-etching on the second substrate, and carrying out secondary chemical cleaning on the second substrate subjected to secondary micro-etching to form the target flexible plate. According to the method |
| format | Patent |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Flexible board with thick base material copper and manufacturing method thereof |
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