Flexible board with thick base material copper and manufacturing method thereof
The invention discloses a flexible board with thick base material copper and a manufacturing method of the flexible board. The method comprises the following steps: providing a flexible substrate after drilling; the flexible substrate is provided with thick base material copper, and the thickness ra...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a flexible board with thick base material copper and a manufacturing method of the flexible board. The method comprises the following steps: providing a flexible substrate after drilling; the flexible substrate is provided with thick base material copper, and the thickness range of the thick base material copper is 18-35 microns; according to the first micro-etching parameter, performing primary micro-etching on the flexible substrate, and performing primary chemical cleaning on the flexible substrate after the primary micro-etching to form a first substrate; plating a carbon film on the first substrate based on the second micro-etching parameter and the third micro-etching parameter to form a second substrate; and according to the fourth micro-etching parameter, carrying out secondary micro-etching on the second substrate, and carrying out secondary chemical cleaning on the second substrate subjected to secondary micro-etching to form the target flexible plate. According to the method |
---|