High-frequency board stacking structure

The invention discloses a high-frequency board stacking structure, and belongs to the technical field of microwaves. The device comprises a structural shell, an upper-layer high-frequency board, a lower-layer high-frequency board, an output end connector, an input end connector and a male connector,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LI SHULIANG, ZHOU HAILING, WAN JIWEI, JIANG TAO, ZHANG YUHUA, LIU LONG, LIU YUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention discloses a high-frequency board stacking structure, and belongs to the technical field of microwaves. The device comprises a structural shell, an upper-layer high-frequency board, a lower-layer high-frequency board, an output end connector, an input end connector and a male connector, the upper-layer high-frequency board is provided with an upper-layer high-frequency board structure positioning hole and an avoiding hole for avoiding an output end connector on the lower-layer high-frequency board, and the lower-layer high-frequency board is provided with a lower-layer high-frequency board structure positioning hole and an avoiding groove hole for avoiding an input end connector on the upper-layer high-frequency board; the upper-layer high-frequency board and the lower-layer high-frequency board are stacked and then mounted in the structural shell; male head connectors are respectively arranged on the upper sides of the upper-layer high-frequency board and the lower-layer high-frequency board and