SYSTEM AND METHOD FOR ELECTRONIC DIE INKING AFTER AUTOMATED VISUAL DEFECT INSPECTION
The invention relates to a system and method for electronic die inking after automatic visual defect inspection. In a method (1000A) of providing a semiconductor device and a computer readable medium having instructions for performing the method, the method (1000A) includes receiving (1005) a first...
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| creator | JANSSEN, MARCEL, J GORDON CHARLES DAVID PAQUETTE BRIAN W SAMEK, VINCENT, C BARTON JESSE ELLIS TRUMBALL ERIC ROBERT CURRAN DAVID MATTHEW |
| description | The invention relates to a system and method for electronic die inking after automatic visual defect inspection. In a method (1000A) of providing a semiconductor device and a computer readable medium having instructions for performing the method, the method (1000A) includes receiving (1005) a first wafer defect map defining a comparison region and identifying a visual defect location of a wafer. A format of the comparison region is determined (1010), wherein the format is selected from the group comprising die-to-die, partial lens-to-partial lens, and full lens-to-full lens. If the comparison format is not die-to-die (1015), mapping information is received (1020) that provides a die position within the comparison area. A wafer layout is provided (1025) that identifies die locations within the wafer.
本申请题为"用于自动视觉缺陷检查之后的电子裸片覆墨的系统和方法"。在提供半导体器件的方法(1000A)和具有用于执行该方法的指令的计算机可读介质中，该方法(1000A)包括接收(1005)第一晶圆缺陷图，其定义比较区域并标识晶圆的视觉缺陷位置。确定(1010)比较区域的格式，其中该格式选自包括裸片到裸片、部分镜头到部分镜头和全镜头到全镜头的组。如果比较格式不是裸片到裸片(1015)，则接收(1020)映射信息，其提供比较区 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117612962A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117612962A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117612962A3</originalsourceid><addsrcrecordid>eNqNyrEKwjAQANAsDqL-w_kBDqlQcTySiz1sEmmuglMpEifRQv1_zOAHOL3lLZWkWxLygMGCJ2miBRc7oJaMdDGwAcsEHM4cToBOqAPsJXoUsnDl1GMLllzZJaVLkWNYq8VjfM5583Olto7ENLs8vYc8T-M9v_JnMEHrQ62rY13h_p_zBR1DMAw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM AND METHOD FOR ELECTRONIC DIE INKING AFTER AUTOMATED VISUAL DEFECT INSPECTION</title><source>esp@cenet</source><creator>JANSSEN, MARCEL, J ; GORDON CHARLES DAVID ; PAQUETTE BRIAN W ; SAMEK, VINCENT, C ; BARTON JESSE ELLIS ; TRUMBALL ERIC ROBERT ; CURRAN DAVID MATTHEW</creator><creatorcontrib>JANSSEN, MARCEL, J ; GORDON CHARLES DAVID ; PAQUETTE BRIAN W ; SAMEK, VINCENT, C ; BARTON JESSE ELLIS ; TRUMBALL ERIC ROBERT ; CURRAN DAVID MATTHEW</creatorcontrib><description>The invention relates to a system and method for electronic die inking after automatic visual defect inspection. In a method (1000A) of providing a semiconductor device and a computer readable medium having instructions for performing the method, the method (1000A) includes receiving (1005) a first wafer defect map defining a comparison region and identifying a visual defect location of a wafer. A format of the comparison region is determined (1010), wherein the format is selected from the group comprising die-to-die, partial lens-to-partial lens, and full lens-to-full lens. If the comparison format is not die-to-die (1015), mapping information is received (1020) that provides a die position within the comparison area. A wafer layout is provided (1025) that identifies die locations within the wafer.
本申请题为"用于自动视觉缺陷检查之后的电子裸片覆墨的系统和方法"。在提供半导体器件的方法(1000A)和具有用于执行该方法的指令的计算机可读介质中，该方法(1000A)包括接收(1005)第一晶圆缺陷图，其定义比较区域并标识晶圆的视觉缺陷位置。确定(1010)比较区域的格式，其中该格式选自包括裸片到裸片、部分镜头到部分镜头和全镜头到全镜头的组。如果比较格式不是裸片到裸片(1015)，则接收(1020)映射信息，其提供比较区</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240227&DB=EPODOC&CC=CN&NR=117612962A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240227&DB=EPODOC&CC=CN&NR=117612962A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JANSSEN, MARCEL, J</creatorcontrib><creatorcontrib>GORDON CHARLES DAVID</creatorcontrib><creatorcontrib>PAQUETTE BRIAN W</creatorcontrib><creatorcontrib>SAMEK, VINCENT, C</creatorcontrib><creatorcontrib>BARTON JESSE ELLIS</creatorcontrib><creatorcontrib>TRUMBALL ERIC ROBERT</creatorcontrib><creatorcontrib>CURRAN DAVID MATTHEW</creatorcontrib><title>SYSTEM AND METHOD FOR ELECTRONIC DIE INKING AFTER AUTOMATED VISUAL DEFECT INSPECTION</title><description>The invention relates to a system and method for electronic die inking after automatic visual defect inspection. In a method (1000A) of providing a semiconductor device and a computer readable medium having instructions for performing the method, the method (1000A) includes receiving (1005) a first wafer defect map defining a comparison region and identifying a visual defect location of a wafer. A format of the comparison region is determined (1010), wherein the format is selected from the group comprising die-to-die, partial lens-to-partial lens, and full lens-to-full lens. If the comparison format is not die-to-die (1015), mapping information is received (1020) that provides a die position within the comparison area. A wafer layout is provided (1025) that identifies die locations within the wafer.
本申请题为"用于自动视觉缺陷检查之后的电子裸片覆墨的系统和方法"。在提供半导体器件的方法(1000A)和具有用于执行该方法的指令的计算机可读介质中，该方法(1000A)包括接收(1005)第一晶圆缺陷图，其定义比较区域并标识晶圆的视觉缺陷位置。确定(1010)比较区域的格式，其中该格式选自包括裸片到裸片、部分镜头到部分镜头和全镜头到全镜头的组。如果比较格式不是裸片到裸片(1015)，则接收(1020)映射信息，其提供比较区</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-w_kBDqlQcTySiz1sEmmuglMpEifRQv1_zOAHOL3lLZWkWxLygMGCJ2miBRc7oJaMdDGwAcsEHM4cToBOqAPsJXoUsnDl1GMLllzZJaVLkWNYq8VjfM5583Olto7ENLs8vYc8T-M9v_JnMEHrQ62rY13h_p_zBR1DMAw</recordid><startdate>20240227</startdate><enddate>20240227</enddate><creator>JANSSEN, MARCEL, J</creator><creator>GORDON CHARLES DAVID</creator><creator>PAQUETTE BRIAN W</creator><creator>SAMEK, VINCENT, C</creator><creator>BARTON JESSE ELLIS</creator><creator>TRUMBALL ERIC ROBERT</creator><creator>CURRAN DAVID MATTHEW</creator><scope>EVB</scope></search><sort><creationdate>20240227</creationdate><title>SYSTEM AND METHOD FOR ELECTRONIC DIE INKING AFTER AUTOMATED VISUAL DEFECT INSPECTION</title><author>JANSSEN, MARCEL, J ; GORDON CHARLES DAVID ; PAQUETTE BRIAN W ; SAMEK, VINCENT, C ; BARTON JESSE ELLIS ; TRUMBALL ERIC ROBERT ; CURRAN DAVID MATTHEW</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117612962A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JANSSEN, MARCEL, J</creatorcontrib><creatorcontrib>GORDON CHARLES DAVID</creatorcontrib><creatorcontrib>PAQUETTE BRIAN W</creatorcontrib><creatorcontrib>SAMEK, VINCENT, C</creatorcontrib><creatorcontrib>BARTON JESSE ELLIS</creatorcontrib><creatorcontrib>TRUMBALL ERIC ROBERT</creatorcontrib><creatorcontrib>CURRAN DAVID MATTHEW</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JANSSEN, MARCEL, J</au><au>GORDON CHARLES DAVID</au><au>PAQUETTE BRIAN W</au><au>SAMEK, VINCENT, C</au><au>BARTON JESSE ELLIS</au><au>TRUMBALL ERIC ROBERT</au><au>CURRAN DAVID MATTHEW</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD FOR ELECTRONIC DIE INKING AFTER AUTOMATED VISUAL DEFECT INSPECTION</title><date>2024-02-27</date><risdate>2024</risdate><abstract>The invention relates to a system and method for electronic die inking after automatic visual defect inspection. In a method (1000A) of providing a semiconductor device and a computer readable medium having instructions for performing the method, the method (1000A) includes receiving (1005) a first wafer defect map defining a comparison region and identifying a visual defect location of a wafer. A format of the comparison region is determined (1010), wherein the format is selected from the group comprising die-to-die, partial lens-to-partial lens, and full lens-to-full lens. If the comparison format is not die-to-die (1015), mapping information is received (1020) that provides a die position within the comparison area. A wafer layout is provided (1025) that identifies die locations within the wafer.
本申请题为"用于自动视觉缺陷检查之后的电子裸片覆墨的系统和方法"。在提供半导体器件的方法(1000A)和具有用于执行该方法的指令的计算机可读介质中，该方法(1000A)包括接收(1005)第一晶圆缺陷图，其定义比较区域并标识晶圆的视觉缺陷位置。确定(1010)比较区域的格式，其中该格式选自包括裸片到裸片、部分镜头到部分镜头和全镜头到全镜头的组。如果比较格式不是裸片到裸片(1015)，则接收(1020)映射信息，其提供比较区</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | SYSTEM AND METHOD FOR ELECTRONIC DIE INKING AFTER AUTOMATED VISUAL DEFECT INSPECTION |
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