SYSTEM AND METHOD FOR ELECTRONIC DIE INKING AFTER AUTOMATED VISUAL DEFECT INSPECTION

The invention relates to a system and method for electronic die inking after automatic visual defect inspection. In a method (1000A) of providing a semiconductor device and a computer readable medium having instructions for performing the method, the method (1000A) includes receiving (1005) a first wafer defect map defining a comparison region and identifying a visual defect location of a wafer. A format of the comparison region is determined (1010), wherein the format is selected from the group comprising die-to-die, partial lens-to-partial lens, and full lens-to-full lens. If the comparison format is not die-to-die (1015), mapping information is received (1020) that provides a die position within the comparison area. A wafer layout is provided (1025) that identifies die locations within the wafer. 本申请题为"用于自动视觉缺陷检查之后的电子裸片覆墨的系统和方法"。在提供半导体器件的方法(1000A)和具有用于执行该方法的指令的计算机可读介质中，该方法(1000A)包括接收(1005)第一晶圆缺陷图，其定义比较区域并标识晶圆的视觉缺陷位置。确定(1010)比较区域的格式，其中该格式选自包括裸片到裸片、部分镜头到部分镜头和全镜头到全镜头的组。如果比较格式不是裸片到裸片(1015)，则接收(1020)映射信息，其提供比较区