Incongruous etching liquid for manufacturing chip on film and application method of incongruous etching liquid
The invention discloses an anisotropic etching solution for manufacturing a chip-on-film and an application method thereof, and relates to the technical field of chip-on-film manufacturing, and the anisotropic etching solution for manufacturing the chip-on-film comprises the following raw materials...
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| creator | SUN MANHUI ZHAO YIHUI WANG HONGQING |
| description | The invention discloses an anisotropic etching solution for manufacturing a chip-on-film and an application method thereof, and relates to the technical field of chip-on-film manufacturing, and the anisotropic etching solution for manufacturing the chip-on-film comprises the following raw materials in parts by weight: 500-600 parts of ferric trichloride, 20-50 parts of hydrochloric acid, 1000-1200 parts of water and 300-500 parts of a potassium permanganate solution. According to the anisotropic etching solution for manufacturing the chip on film and the application method of the anisotropic etching solution, etching of the etching solution on a copper foil is an oxidation-reduction process, Fe < 3 + > on the surface of copper oxidizes copper into cuprous chloride, Fe < 3 + > is reduced into Fe < 2 + >, Fe < 2 + > reacts with a potassium permanganate solution to be reduced into Fe < 3 + >, Fe < 3 + > continues to work, Fe < 3 + > is continuously converted into Fe < 3 + >, sufficient Fe < 3 + > is kept, and th |
| format | Patent |
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According to the anisotropic etching solution for manufacturing the chip on film and the application method of the anisotropic etching solution, etching of the etching solution on a copper foil is an oxidation-reduction process, Fe < 3 + > on the surface of copper oxidizes copper into cuprous chloride, Fe < 3 + > is reduced into Fe < 2 + >, Fe < 2 + > reacts with a potassium permanganate solution to be reduced into Fe < 3 + >, Fe < 3 + > continues to work, Fe < 3 + > is continuously converted into Fe < 3 + >, sufficient Fe < 3 + > is kept, and th]]></description><language>chi ; eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING ; NATURAL RESINS ; PAINTS ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; POLISHES ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240227&DB=EPODOC&CC=CN&NR=117603692A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240227&DB=EPODOC&CC=CN&NR=117603692A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUN MANHUI</creatorcontrib><creatorcontrib>ZHAO YIHUI</creatorcontrib><creatorcontrib>WANG HONGQING</creatorcontrib><title>Incongruous etching liquid for manufacturing chip on film and application method of incongruous etching liquid</title><description><![CDATA[The invention discloses an anisotropic etching solution for manufacturing a chip-on-film and an application method thereof, and relates to the technical field of chip-on-film manufacturing, and the anisotropic etching solution for manufacturing the chip-on-film comprises the following raw materials in parts by weight: 500-600 parts of ferric trichloride, 20-50 parts of hydrochloric acid, 1000-1200 parts of water and 300-500 parts of a potassium permanganate solution. According to the anisotropic etching solution for manufacturing the chip on film and the application method of the anisotropic etching solution, etching of the etching solution on a copper foil is an oxidation-reduction process, Fe < 3 + > on the surface of copper oxidizes copper into cuprous chloride, Fe < 3 + > is reduced into Fe < 2 + >, Fe < 2 + > reacts with a potassium permanganate solution to be reduced into Fe < 3 + >, Fe < 3 + > continues to work, Fe < 3 + > is continuously converted into Fe < 3 + >, sufficient Fe < 3 + > is kept, and th]]></description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjEEKwjAQRbNxIeodxgMI1kLFpRRFN67clyGZtAPJTGyT-1vBreDqwX-ftzRyF6vSj0XLBJTtwNJD4FdhB15HiCjFo81l_IhZJ1ABzyECigNMKbDFzPMYKQ_qQD3wz-baLDyGiTZfrsz2enm2tx0l7WhKaEkod-2jqo7Nvm5Oh3P9z-cNI7NDSA</recordid><startdate>20240227</startdate><enddate>20240227</enddate><creator>SUN MANHUI</creator><creator>ZHAO YIHUI</creator><creator>WANG HONGQING</creator><scope>EVB</scope></search><sort><creationdate>20240227</creationdate><title>Incongruous etching liquid for manufacturing chip on film and application method of incongruous etching liquid</title><author>SUN MANHUI ; ZHAO YIHUI ; WANG HONGQING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117603692A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SUN MANHUI</creatorcontrib><creatorcontrib>ZHAO YIHUI</creatorcontrib><creatorcontrib>WANG HONGQING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUN MANHUI</au><au>ZHAO YIHUI</au><au>WANG HONGQING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Incongruous etching liquid for manufacturing chip on film and application method of incongruous etching liquid</title><date>2024-02-27</date><risdate>2024</risdate><abstract><![CDATA[The invention discloses an anisotropic etching solution for manufacturing a chip-on-film and an application method thereof, and relates to the technical field of chip-on-film manufacturing, and the anisotropic etching solution for manufacturing the chip-on-film comprises the following raw materials in parts by weight: 500-600 parts of ferric trichloride, 20-50 parts of hydrochloric acid, 1000-1200 parts of water and 300-500 parts of a potassium permanganate solution. According to the anisotropic etching solution for manufacturing the chip on film and the application method of the anisotropic etching solution, etching of the etching solution on a copper foil is an oxidation-reduction process, Fe < 3 + > on the surface of copper oxidizes copper into cuprous chloride, Fe < 3 + > is reduced into Fe < 2 + >, Fe < 2 + > reacts with a potassium permanganate solution to be reduced into Fe < 3 + >, Fe < 3 + > continues to work, Fe < 3 + > is continuously converted into Fe < 3 + >, sufficient Fe < 3 + > is kept, and th]]></abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POLISHES SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Incongruous etching liquid for manufacturing chip on film and application method of incongruous etching liquid |
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