Incongruous etching liquid for manufacturing chip on film and application method of incongruous etching liquid
The invention discloses an anisotropic etching solution for manufacturing a chip-on-film and an application method thereof, and relates to the technical field of chip-on-film manufacturing, and the anisotropic etching solution for manufacturing the chip-on-film comprises the following raw materials...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an anisotropic etching solution for manufacturing a chip-on-film and an application method thereof, and relates to the technical field of chip-on-film manufacturing, and the anisotropic etching solution for manufacturing the chip-on-film comprises the following raw materials in parts by weight: 500-600 parts of ferric trichloride, 20-50 parts of hydrochloric acid, 1000-1200 parts of water and 300-500 parts of a potassium permanganate solution. According to the anisotropic etching solution for manufacturing the chip on film and the application method of the anisotropic etching solution, etching of the etching solution on a copper foil is an oxidation-reduction process, Fe < 3 + > on the surface of copper oxidizes copper into cuprous chloride, Fe < 3 + > is reduced into Fe < 2 + >, Fe < 2 + > reacts with a potassium permanganate solution to be reduced into Fe < 3 + >, Fe < 3 + > continues to work, Fe < 3 + > is continuously converted into Fe < 3 + >, sufficient Fe < 3 + > is kept, and th |
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