Single-layer resin film bonding material and preparation method of test board of single-layer resin film bonding material

The invention discloses a preparation method of a single-layer resin film bonding material and a test board thereof. The method comprises the following steps: taking thermosetting resin as a main body, preparing a mixed glue solution by adding ceramic powder, an initiator and a cross-linking agent, coating the glue solution on the surface of a thin film by adopting a coating process, curing at a certain temperature to obtain a single-layer film bonding material, laminating the bonding material, and carrying out double-sided copper-clad lamination to prepare a test board A; a bonding material is arranged between the copper-clad plates to be laminated to prepare a test plate B; the thickness range of the single-layer film bonding material prepared by the method is 1.31 [mu] m, the bonding strength between the single-layer film bonding material and a copper foil is 5.2 N/mm, the resin fluidity is 3.3%, the dielectric property is uniform and stable, a prepared test board B is free of board explosion during tin bl