Boron nitride heat-conducting material with three-dimensional network structure as well as preparation and application of boron nitride heat-conducting material
The invention relates to a boron nitride heat conduction material with a three-dimensional network structure and preparation and application thereof.The preparation method comprises the steps that 1, chitosan and a polyacrylic acid solution are dropwise added into a boron nitride solution, stirring...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a boron nitride heat conduction material with a three-dimensional network structure and preparation and application thereof.The preparation method comprises the steps that 1, chitosan and a polyacrylic acid solution are dropwise added into a boron nitride solution, stirring is conducted for 30 min to 60 min in an oil bath at 85 DEG C, and the mixture is placed in a normal-temperature water bath to be stirred for 3 h to 4 h; (2) performing dispersion treatment in a planetary dispersion machine, performing ultrasonic treatment in an ultrasonic cleaning machine for 20-30 minutes, uniformly extruding the hydrogel by using extrusion equipment, performing ice assembly for 10-20 minutes in a freezing chamber of a refrigerator at-18 DEG C to-22 DEG C, unfreezing the film in ethanol, performing solvent exchange in acetone, finally taking out the film, and performing drying at 65 DEG C under normal pressure in a drying oven. The boron nitride heat conduction material has a three-dimensional net |
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