Cutting method of LED device packaging array and LED packaging device

The invention relates to a cutting method of an LED device packaging array and an LED packaging device. The LED device packaging array comprises a substrate, a plurality of LED chips and a packaging adhesive layer, the LED chips are arranged on the front face of the substrate and arranged in a matrix mode, and the packaging adhesive wraps each LED chip and is attached to the front face of the substrate. The cutting method comprises the steps that a cutting blade perpendicular to a substrate is made to cut a packaging adhesive layer in the direction horizontal to the substrate at the position above the front face of the substrate, and a cutting channel is formed; and the cutting blade perpendicular to the substrate cuts off the substrate along the cutting channel again. Compared with the prior art, the method comprises two times of cutting, the first-time cutting position is located at the bottom of the packaging glue layer and above the substrate, the second-time cutting cuts through the substrate, glue protr