SEMICONDUCTOR DEVICE AND METHOD OF FORMING PACKAGE WITH DUAL SIDE INTEGRATED PASSIVE DEVICE

The invention relates to a semiconductor device and a method of forming a package with a dual-side integrated passive device. The semiconductor device includes: a semiconductor die; a substrate; and a plurality of first conductive pillars formed on the semiconductor die or the substrate. Alternative...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE TAE-KEUN, BAE HYUN-IL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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