SEMICONDUCTOR DEVICE AND METHOD OF FORMING PACKAGE WITH DUAL SIDE INTEGRATED PASSIVE DEVICE

The invention relates to a semiconductor device and a method of forming a package with a dual-side integrated passive device. The semiconductor device includes: a semiconductor die; a substrate; and a plurality of first conductive pillars formed on the semiconductor die or the substrate. Alternatively, a first conductive pillar is formed over the semiconductor die and the substrate. An electrical component is disposed over the semiconductor die. The electrical component can be a two-sided IPD. The semiconductor die and the electrical component are disposed on the substrate. A shielding frame is disposed over the semiconductor die. A plurality of second conductive pillars are formed on the first surface of the electrical component. A plurality of third conductive pillars are formed on a second surface of the electrical component opposite the first surface of the electrical component. A bump cap can be formed on the distal end of the conductive pillar. The substrate has a cavity, and the electrical component is