High-thermal-conductivity low-loss carbon fiber composite material suitable for heat dissipation of electronic device and preparation method thereof

The invention relates to a high-thermal-conductivity low-loss carbon fiber composite material suitable for heat dissipation of an electronic device and a preparation method thereof.The preparation method comprises the steps that firstly, carbon fiber filaments are prepared into a carbon fiber felt through an airflow carding-needling integrated technology, then stepped heating is conducted, and the modified carbon fiber felt is obtained; and uniformly depositing the deposition material on carbon fibers in a high-temperature chemical vapor deposition manner to form a carbon fiber composite material with a coating structure, and graphitizing the deposited carbon fiber composite material to obtain the modified carbon fiber composite material. Finally, the epoxy carbon fiber composite material with high thermal conductivity and low loss is prepared in a vacuum mold pressing curing forming mode. The in-plane thermal conductivity of the prepared carbon fiber composite material is greater than 10W/mK, and the carbon