Polyimide aluminum foil composite film as well as preparation method and application thereof

The invention relates to the field of high polymer materials, and particularly discloses a polyimide aluminum foil composite film and a preparation method and application thereof. The polyimide aluminum foil composite film is composed of an aluminum foil layer A, a thermoplastic polyimide layer B an...

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Bibliographische Detailangaben
Hauptverfasser:	HU YONG, YANG XIDONG, ZHOU DINGKANG, MIAO WENBIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STORING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The invention relates to the field of high polymer materials, and particularly discloses a polyimide aluminum foil composite film and a preparation method and application thereof. The polyimide aluminum foil composite film is composed of an aluminum foil layer A, a thermoplastic polyimide layer B and a thermosetting polyimide layer C; the thermoplastic polyimide layer B comprises a thermoplastic polyimide layer B1 and a thermoplastic polyimide layer B2; the thermosetting polyimide layer C comprises a thermosetting polyimide layer C1 and a thermosetting polyimide layer C2; the polyimide aluminum foil composite film is of a structure of C1-CB1-A-B2-C2; the thermoplastic polyimide layer B is formed by polymerizing a diamine monomer and a dianhydride monomer, and the thermosetting polyimide layer C is formed by polymerizing a diamine monomer, a dianhydride monomer and an auxiliary material. The composite film is high in elongation rate, the stripping force of polyimide and the aluminum foil layer is high, and the