Glass substrate embedded PIC-to-PIC and off-chip photonic communication

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package includes a first layer, where the first layer includes glass. In an embodiment, a second layer is over the first layer, where the second layer includes a molding material. In an embodiment, a first photonic integrated circuit (PIC) is within the second layer. In an embodiment, a second PIC is within the second layer, and a waveguide is in the first layer. In an embodiment, the waveguide optically couples the first PIC to the second PIC. 本文公开的实施例包括电子封装和形成这种电子封装的方法。在实施例中，一种电子封装包括第一层，其中，所述第一层包括玻璃。在实施例中，第二层在所述第一层上方，其中，所述第二层包括模制材料。在实施例中，第一光子集成电路(PIC)在所述第二层之内。在实施例中，第二PIC在所述第二层之内，并且波导在所述第一层中。在实施例中，所述波导将所述第一PIC光学耦接到所述第二PIC。