Method for producing optoelectronic component and optoelectronic component

The invention relates to a method for producing an optoelectronic component, comprising the following steps: arranging a first optoelectronic semiconductor structure on an underside of a glass sheet, said first optoelectronic semiconductor structure comprising a first structure carrier and an epitaxially grown first semiconductor layer sequence, said first semiconductor layer sequence being oriented towards the glass sheet; arranging a molding material on the underside of the glass plate, wherein the first optoelectronic semiconductor structure is embedded in the molding material; removing the forming material and a portion of the first structure carrier so as to expose the first semiconductor layer sequence; forming an electrical contact on the first semiconductor layer sequence; connecting a semiconductor element having a circuit integrated on the front side to the first semiconductor layer sequence, wherein a circuit electrical contact of the circuit is connected to an electrical contact of the first semic