Solder paste and method for manufacturing electronic device

Solder paste and method for manufacturing electronic device

This solder paste contains a flux composition and a solder powder, and is configured such that G '100 and G' 100 satisfy G '100 > G' 100, where G '100 is the storage modulus at 100 DEG C and G' 100 is the loss modulus at 100 DEG C measured using a rheometer on the ba...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SAKUMA HARUYA, ASAMI AI, TAKAGI AKIKO, YOSHIDA HISAHIKO
Format: Patent
Sprache:chi ; eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:This solder paste contains a flux composition and a solder powder, and is configured such that G '100 and G' 100 satisfy G '100 > G' 100, where G '100 is the storage modulus at 100 DEG C and G' 100 is the loss modulus at 100 DEG C measured using a rheometer on the basis of prescribed measurement conditions for flux residues obtained from the solder paste in a prescribed production step. 本发明的焊膏是包含助焊剂组合物和焊料粉末的焊膏，其中，所述焊膏被构成为：将对于按照规定的制作步骤由该焊膏得到的助焊剂残渣基于规定的测定条件使用流变仪测定的100℃时的储能模量设为G'100、损耗模量设为G"100时，G'100和G"100满足G'100＞G"100。