Manufacturing method of high-heat-conductivity circuit board embedded with heat conduction radiator and circuit board

The invention relates to the technical field of printed circuit boards, and discloses a manufacturing method of a high-heat-conductivity circuit board embedded with a heat conduction radiator and a circuit board, and the manufacturing method comprises the steps: providing a substrate and a high-temperature protection film, the substrate is provided with an embedded sunken part, and the embedded sunken part is provided with a first opening and a second opening; the heat conduction radiator is embedded in the embedded concave part through the second opening, and the space, except for the heat conduction radiator, of the embedded concave part is a filling space; the filling space is filled with semi-solidified first heat conduction slurry from the second opening, the first heat conduction slurry occupies part of the filling space, and the volume of the first heat conduction slurry is a first volume; the filling space is set to be in a vacuum state; the filling space is filled with semi-solidified second heat con