Base plate for drilling of printed circuit board and preparation method of base plate

The invention relates to the technical field of PCB processing and preparation, in particular to a base plate for drilling of a printed circuit board and a preparation method thereof, comprising an upper surface material layer, an upper lubricating heat dissipation resin layer, a metal core material...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LI RENSHENG, ZHONG LINJUN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of PCB processing and preparation, in particular to a base plate for drilling of a printed circuit board and a preparation method thereof, comprising an upper surface material layer, an upper lubricating heat dissipation resin layer, a metal core material layer, a lower lubricating heat dissipation resin layer and a lower surface material layer which are sequentially arranged from top to bottom, wherein the upper lubricating heat dissipation resin layer and the lower lubricating heat dissipation resin layer are formed by coating lubricating heat dissipation resin. According to the base plate, the lubricating heat dissipation resin layers are formed by coating the lubricating heat dissipation resin on the upper surface and the lower surface of the metal core material layer, and the plane materials are arranged on the surfaces of the lubricating heat dissipation resin layers respectively, so that internal stress generated in the using process of the base plate can be