Radiation-resistant reinforced semiconductor device structure

The invention relates to an anti-radiation reinforced semiconductor device structure, which comprises a substrate, the substrate comprises a front surface, and a front surface process is carried out on the front surface of the substrate so as to prepare a normal-pressure power device unit and a high...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: XIE RUBIN, LI YANFEI, SUN JIALIN, HONG GENSHEN, DING BING
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator XIE RUBIN
LI YANFEI
SUN JIALIN
HONG GENSHEN
DING BING
description The invention relates to an anti-radiation reinforced semiconductor device structure, which comprises a substrate, the substrate comprises a front surface, and a front surface process is carried out on the front surface of the substrate so as to prepare a normal-pressure power device unit and a high-voltage power device unit at the same time; the normal-pressure power device unit comprises at least one normal-pressure power device, the high-voltage power device unit comprises at least one high-voltage power device, and the normal-pressure power device and the high-voltage power device are mutually isolated and independent; active region units which are isolated from each other are formed in the high-voltage power device, the active region units are provided with first junction depths, and the first junction depths are larger than the junction depths of the active region units of the normal-voltage power device, so that the withstand voltage of the high-voltage power device is not lower than that of the normal
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117525066A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117525066A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117525066A3</originalsourceid><addsrcrecordid>eNrjZLANSkzJTCzJzM_TLUotziwuScwrUShKzcxLyy9KTk1RKE7NzUzOz0spTS7JL1JISS3LTE5VKC4pAvJLi1J5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakm8s5-hobmpkamBmZmjMTFqAKIMMUw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Radiation-resistant reinforced semiconductor device structure</title><source>esp@cenet</source><creator>XIE RUBIN ; LI YANFEI ; SUN JIALIN ; HONG GENSHEN ; DING BING</creator><creatorcontrib>XIE RUBIN ; LI YANFEI ; SUN JIALIN ; HONG GENSHEN ; DING BING</creatorcontrib><description>The invention relates to an anti-radiation reinforced semiconductor device structure, which comprises a substrate, the substrate comprises a front surface, and a front surface process is carried out on the front surface of the substrate so as to prepare a normal-pressure power device unit and a high-voltage power device unit at the same time; the normal-pressure power device unit comprises at least one normal-pressure power device, the high-voltage power device unit comprises at least one high-voltage power device, and the normal-pressure power device and the high-voltage power device are mutually isolated and independent; active region units which are isolated from each other are formed in the high-voltage power device, the active region units are provided with first junction depths, and the first junction depths are larger than the junction depths of the active region units of the normal-voltage power device, so that the withstand voltage of the high-voltage power device is not lower than that of the normal</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240206&amp;DB=EPODOC&amp;CC=CN&amp;NR=117525066A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240206&amp;DB=EPODOC&amp;CC=CN&amp;NR=117525066A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XIE RUBIN</creatorcontrib><creatorcontrib>LI YANFEI</creatorcontrib><creatorcontrib>SUN JIALIN</creatorcontrib><creatorcontrib>HONG GENSHEN</creatorcontrib><creatorcontrib>DING BING</creatorcontrib><title>Radiation-resistant reinforced semiconductor device structure</title><description>The invention relates to an anti-radiation reinforced semiconductor device structure, which comprises a substrate, the substrate comprises a front surface, and a front surface process is carried out on the front surface of the substrate so as to prepare a normal-pressure power device unit and a high-voltage power device unit at the same time; the normal-pressure power device unit comprises at least one normal-pressure power device, the high-voltage power device unit comprises at least one high-voltage power device, and the normal-pressure power device and the high-voltage power device are mutually isolated and independent; active region units which are isolated from each other are formed in the high-voltage power device, the active region units are provided with first junction depths, and the first junction depths are larger than the junction depths of the active region units of the normal-voltage power device, so that the withstand voltage of the high-voltage power device is not lower than that of the normal</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLANSkzJTCzJzM_TLUotziwuScwrUShKzcxLyy9KTk1RKE7NzUzOz0spTS7JL1JISS3LTE5VKC4pAvJLi1J5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakm8s5-hobmpkamBmZmjMTFqAKIMMUw</recordid><startdate>20240206</startdate><enddate>20240206</enddate><creator>XIE RUBIN</creator><creator>LI YANFEI</creator><creator>SUN JIALIN</creator><creator>HONG GENSHEN</creator><creator>DING BING</creator><scope>EVB</scope></search><sort><creationdate>20240206</creationdate><title>Radiation-resistant reinforced semiconductor device structure</title><author>XIE RUBIN ; LI YANFEI ; SUN JIALIN ; HONG GENSHEN ; DING BING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117525066A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>XIE RUBIN</creatorcontrib><creatorcontrib>LI YANFEI</creatorcontrib><creatorcontrib>SUN JIALIN</creatorcontrib><creatorcontrib>HONG GENSHEN</creatorcontrib><creatorcontrib>DING BING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XIE RUBIN</au><au>LI YANFEI</au><au>SUN JIALIN</au><au>HONG GENSHEN</au><au>DING BING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Radiation-resistant reinforced semiconductor device structure</title><date>2024-02-06</date><risdate>2024</risdate><abstract>The invention relates to an anti-radiation reinforced semiconductor device structure, which comprises a substrate, the substrate comprises a front surface, and a front surface process is carried out on the front surface of the substrate so as to prepare a normal-pressure power device unit and a high-voltage power device unit at the same time; the normal-pressure power device unit comprises at least one normal-pressure power device, the high-voltage power device unit comprises at least one high-voltage power device, and the normal-pressure power device and the high-voltage power device are mutually isolated and independent; active region units which are isolated from each other are formed in the high-voltage power device, the active region units are provided with first junction depths, and the first junction depths are larger than the junction depths of the active region units of the normal-voltage power device, so that the withstand voltage of the high-voltage power device is not lower than that of the normal</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN117525066A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Radiation-resistant reinforced semiconductor device structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T00%3A01%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=XIE%20RUBIN&rft.date=2024-02-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117525066A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true