Low-temperature silver paste, preparation method and HJT battery
The low-temperature silver paste comprises the following preparation raw materials in parts by weight: 88%-94% of silver powder, 1%-2.5% of fluorinated polyamide acid, 0.1%-1.0% of a curing agent, 5%-10% of a first solvent and 0%-1.5% of an organic auxiliary agent. After the fluorinated polyamide ac...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The low-temperature silver paste comprises the following preparation raw materials in parts by weight: 88%-94% of silver powder, 1%-2.5% of fluorinated polyamide acid, 0.1%-1.0% of a curing agent, 5%-10% of a first solvent and 0%-1.5% of an organic auxiliary agent. After the fluorinated polyamide acid is added into the low-temperature silver paste, the silver paste has excellent aging resistance, conductivity and thixotropy and can be used for printing precise circuit patterns. The invention further discloses a preparation method of the low-temperature silver paste and an HJT battery.
本发明公开了一种低温银浆,包括以下重量份的制备原料:银粉88%-94%,氟化聚酰胺酸1%-2.5%,固化剂0.1%-1.0%,第一溶剂5%-10%及有机助剂0%-1.5%。本发明通过在低温银浆中添加氟化聚酰胺酸后,使得银浆具有优良的抗老化性、导电性和优异的触变性,可用于精密电路图案的印刷。本发明还公开了一种低温银浆的制备方法和HJT电池。 |
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