Multi-cutter scribing device and control method thereof

The invention relates to the technical field of semiconductor manufacturing, in particular to a multi-cutting-knife scribing device and a control method thereof, and the multi-cutting-knife scribing control method comprises the steps: adopting the multi-cutting-knife scribing device to perform scribing on a wafer; the multi-cutter scribing device comprises a machine base, N blades and an adjusting mechanism, the N blades are coaxially arranged on the machine base, a preset distance is formed between every two adjacent blades, each blade can rotate around the axis of the blade so as to conduct scribing on a wafer, and the adjusting mechanism is configured to adjust the distance between the N blades and the adjusting mechanism after the N blades conduct partial scribing on the wafer. The number of blades used for cutting the wafer is adjusted to be X according to the number of the remaining scribing channels on the wafer so that the X blades can cut all the remaining scribing channels on the wafer, and therefor