Wafer polishing method, system and equipment and storage medium

The invention relates to the technical field of semiconductor manufacturing, and discloses a wafer polishing method, system and device and a storage medium, and the method comprises the steps: determining a polishing condition based on parameter data of a target wafer, a wafer carrier, a polishing pad, a polishing solution and a polishing platform; carrying out polishing operation on the polishing pad based on the polishing condition; the polishing pad subjected to polishing operation is cleaned; and after the polishing pad is cleaned, polishing operation is carried out on the target wafer. According to the invention, the wafer surface appearance and the removal rate parameter of the wafer in the CMP process are more stable, so that the uniformity and stability of the removal of the film thickness of each wafer are ensured, and the wafer polishing efficiency and the performance stability of chip manufacturing are improved. 本发明涉及半导体制造技术领域，公开了一种晶圆抛光方法、系统、设备及存储介质，方法包括：基于目标晶圆、晶圆载体、抛光垫、抛光液及抛光平台的参数数据，确定抛光条件；基于抛光条件对