Room temperature curing conductive adhesive and preparation method thereof

The invention provides a room temperature curing conductive adhesive and a preparation method thereof.The preparation method comprises the following steps that S1, epoxy resin and a first solvent are mixed, and the epoxy resin comprises glycidyl ester epoxy resin, aliphatic epoxy resin and flexible epoxy resin, the first solvent is at least one of acetone, butanone, cyclohexanone, ethanol, n-butyl alcohol, ethyl acetate and n-butyl acetate, and then carrying out heat preservation in a water bath at 80-100 DEG C until the first solvent is dissolved to obtain an organic carrier; s2, the organic carrier, a second solvent, metal powder, auxiliaries and filler are mixed and stirred to be uniform, the second solvent comprises at least one of acetone, butanone, cyclohexanone, ethyl alcohol, n-butyl alcohol, ethyl acetate and butyl acetate, and a first component is obtained; s3, uniformly stirring and dispersing the fatty amine and accelerant mixture to obtain a second component. The flexible UV ink provided by the i