Grinding device

Provided is a polishing apparatus capable of measuring the surface temperature of a substrate while suppressing shielding caused by a polishing liquid. A polishing device is provided with: a microwave detection sensor (51) that generates microwave detection data by detecting microwaves; and a contro...

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Bibliographische Detailangaben
1. Verfasser:	YOON SEUNG-HO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a polishing apparatus capable of measuring the surface temperature of a substrate while suppressing shielding caused by a polishing liquid. A polishing device is provided with: a microwave detection sensor (51) that generates microwave detection data by detecting microwaves; and a control device (100) that determines the surface temperature of the substrate (W) on the basis of the microwave detection data. 本发明提供一种能够抑制研磨液导致的遮蔽并测定基板的表面温度的研磨装置。研磨装置具备：通过检测微波来生成微波检测数据的微波检测传感器(51)；以及基于微波检测数据来决定基板(W)的表面温度的控制装置(100)。