Glue discharging mechanism for semiconductor packaging glue dispensing device
The invention relates to the technical field of semiconductor dispensing devices, in particular to a glue discharging mechanism for a semiconductor packaging dispensing device, which comprises a lifting mechanism, the lifting mechanism is positioned above a main body mechanism, and the main body mec...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YAO DONGYUN WU WENNING |
| description | The invention relates to the technical field of semiconductor dispensing devices, in particular to a glue discharging mechanism for a semiconductor packaging dispensing device, which comprises a lifting mechanism, the lifting mechanism is positioned above a main body mechanism, and the main body mechanism is fixedly arranged at the bottom end of the lifting mechanism. According to the glue dispensing device, the lifting mechanism and the glue dispensing mechanism are installed, a motor at the upper end of a fixed plate drives a second threaded rod to continuously rotate, so that a second sliding block moves above the second threaded rod, and the glue dispensing mechanism is driven to move up and down for precise glue dispensing; and a rotating device at the bottom end of the connecting plate drives a baffle to stop the water dropper, so that the purposes of improving the dispensing precision and stopping the water dropper to achieve cleaning are achieved. The main body mechanism is installed and arranged, a f |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117483184A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117483184A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117483184A3</originalsourceid><addsrcrecordid>eNrjZPB1zylNVUjJLE7OSCxKz8xLV8hNBTLzMotzFdLyixSKU3Mzk_PzUkqTS4C8gsTk7ESwqnSotoLUvGIQPyW1LDM5lYeBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYDtafmpZbEO_sZGpqbWBgbWpg4GhOjBgAaxTa_</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Glue discharging mechanism for semiconductor packaging glue dispensing device</title><source>esp@cenet</source><creator>YAO DONGYUN ; WU WENNING</creator><creatorcontrib>YAO DONGYUN ; WU WENNING</creatorcontrib><description>The invention relates to the technical field of semiconductor dispensing devices, in particular to a glue discharging mechanism for a semiconductor packaging dispensing device, which comprises a lifting mechanism, the lifting mechanism is positioned above a main body mechanism, and the main body mechanism is fixedly arranged at the bottom end of the lifting mechanism. According to the glue dispensing device, the lifting mechanism and the glue dispensing mechanism are installed, a motor at the upper end of a fixed plate drives a second threaded rod to continuously rotate, so that a second sliding block moves above the second threaded rod, and the glue dispensing mechanism is driven to move up and down for precise glue dispensing; and a rotating device at the bottom end of the connecting plate drives a baffle to stop the water dropper, so that the purposes of improving the dispensing precision and stopping the water dropper to achieve cleaning are achieved. The main body mechanism is installed and arranged, a f</description><language>chi ; eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; PERFORMING OPERATIONS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240202&DB=EPODOC&CC=CN&NR=117483184A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240202&DB=EPODOC&CC=CN&NR=117483184A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAO DONGYUN</creatorcontrib><creatorcontrib>WU WENNING</creatorcontrib><title>Glue discharging mechanism for semiconductor packaging glue dispensing device</title><description>The invention relates to the technical field of semiconductor dispensing devices, in particular to a glue discharging mechanism for a semiconductor packaging dispensing device, which comprises a lifting mechanism, the lifting mechanism is positioned above a main body mechanism, and the main body mechanism is fixedly arranged at the bottom end of the lifting mechanism. According to the glue dispensing device, the lifting mechanism and the glue dispensing mechanism are installed, a motor at the upper end of a fixed plate drives a second threaded rod to continuously rotate, so that a second sliding block moves above the second threaded rod, and the glue dispensing mechanism is driven to move up and down for precise glue dispensing; and a rotating device at the bottom end of the connecting plate drives a baffle to stop the water dropper, so that the purposes of improving the dispensing precision and stopping the water dropper to achieve cleaning are achieved. The main body mechanism is installed and arranged, a f</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>PERFORMING OPERATIONS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB1zylNVUjJLE7OSCxKz8xLV8hNBTLzMotzFdLyixSKU3Mzk_PzUkqTS4C8gsTk7ESwqnSotoLUvGIQPyW1LDM5lYeBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYDtafmpZbEO_sZGpqbWBgbWpg4GhOjBgAaxTa_</recordid><startdate>20240202</startdate><enddate>20240202</enddate><creator>YAO DONGYUN</creator><creator>WU WENNING</creator><scope>EVB</scope></search><sort><creationdate>20240202</creationdate><title>Glue discharging mechanism for semiconductor packaging glue dispensing device</title><author>YAO DONGYUN ; WU WENNING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117483184A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>PERFORMING OPERATIONS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YAO DONGYUN</creatorcontrib><creatorcontrib>WU WENNING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAO DONGYUN</au><au>WU WENNING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Glue discharging mechanism for semiconductor packaging glue dispensing device</title><date>2024-02-02</date><risdate>2024</risdate><abstract>The invention relates to the technical field of semiconductor dispensing devices, in particular to a glue discharging mechanism for a semiconductor packaging dispensing device, which comprises a lifting mechanism, the lifting mechanism is positioned above a main body mechanism, and the main body mechanism is fixedly arranged at the bottom end of the lifting mechanism. According to the glue dispensing device, the lifting mechanism and the glue dispensing mechanism are installed, a motor at the upper end of a fixed plate drives a second threaded rod to continuously rotate, so that a second sliding block moves above the second threaded rod, and the glue dispensing mechanism is driven to move up and down for precise glue dispensing; and a rotating device at the bottom end of the connecting plate drives a baffle to stop the water dropper, so that the purposes of improving the dispensing precision and stopping the water dropper to achieve cleaning are achieved. The main body mechanism is installed and arranged, a f</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117483184A |
| source | esp@cenet |
| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | Glue discharging mechanism for semiconductor packaging glue dispensing device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T21%3A58%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YAO%20DONGYUN&rft.date=2024-02-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117483184A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |