Glue discharging mechanism for semiconductor packaging glue dispensing device

The invention relates to the technical field of semiconductor dispensing devices, in particular to a glue discharging mechanism for a semiconductor packaging dispensing device, which comprises a lifting mechanism, the lifting mechanism is positioned above a main body mechanism, and the main body mechanism is fixedly arranged at the bottom end of the lifting mechanism. According to the glue dispensing device, the lifting mechanism and the glue dispensing mechanism are installed, a motor at the upper end of a fixed plate drives a second threaded rod to continuously rotate, so that a second sliding block moves above the second threaded rod, and the glue dispensing mechanism is driven to move up and down for precise glue dispensing; and a rotating device at the bottom end of the connecting plate drives a baffle to stop the water dropper, so that the purposes of improving the dispensing precision and stopping the water dropper to achieve cleaning are achieved. The main body mechanism is installed and arranged, a f