Electronic device
The invention discloses an electronic device. The electronic device comprises a substrate; the conductive layer is arranged on the substrate, and the conductive layer comprises a plurality of branch parts; the plurality of bonding pads are respectively arranged on the plurality of branch parts of th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an electronic device. The electronic device comprises a substrate; the conductive layer is arranged on the substrate, and the conductive layer comprises a plurality of branch parts; the plurality of bonding pads are respectively arranged on the plurality of branch parts of the conductive layer; and an insulating layer disposed between the conductive layer and the plurality of bonding pads.
本发明公开了一种电子装置,包含:一衬底;一导电层,设置于该衬底上,且该导电层包含多个分支部;多个接合垫,分别设置于该导电层的多个分支部上;以及一绝缘层,设置于该导电层与多个接合垫之间。 |
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