Substrate processing method

The invention aims to provide a processing method of a substrate, which can improve the processing efficiency of the substrate. The method comprises: a step for dividing an unsintered ceramic substrate into small substrates; a step in which the small substrates that have been divided are sintered; a step for arranging the small substrates that have been sintered; a step for fixing the arranged small substrates with an organic material to form a large substrate; a step for processing through-holes by irradiating the small substrates arranged in the large substrate with laser light; a step for embedding a conductor into the through hole; a step for printing wiring on the small substrates arranged in the large substrate; a step for laminating a new layer on the front and back surfaces of the small substrates arranged in the large substrate; and a step for cutting the organic material of the large substrate into the small substrates. 本发明的目的是提供一种基板的加工方法，其可提升基板的加工效率。具有以下工序：将未烧结陶瓷基板分割成小型基板的工序；将已分割的所述小型基板进行烧结的工序；将已烧结