Ultrathin flexible film packaging substrate with multifunctional integrated module

The invention discloses an ultrathin flexible film packaging substrate with a multifunctional integrated module, which relates to the technical field of packaging substrate preparation, and comprises the following steps: providing an insulating substrate with a bonding pad buried on the surface, laminating an ABF material on the insulating substrate, electroplating a copper layer on the surface of the insulating substrate by using a tin plating process, and preparing a silicon dioxide film layer. And an elastic tensile material is added, and the multifunctional chip and the insulating substrate are jointed through high-stability adhesive, so that the ultrathin flexible film packaging substrate is obtained. According to the ultrathin flexible thin film packaging substrate with the multifunctional integrated module, the thermal expansion and cold contraction resistance of the packaging substrate is enhanced, the packaging substrate still has good touch feeling and high-strength flexibility after being stretched