MOUNTING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The invention provides a mounting apparatus and a method of manufacturing a semiconductor device. Provided is a technique capable of improving the accuracy of abnormality inspection of a side surface of an element. The mounting device is provided with: at least one pair of mirrors provided so as to face each other; a shooting device which is arranged in a manner that a bare chip and a reflecting surface of the mirror are positioned in a view field; an illumination device that irradiates illumination light along the optical axis of the imaging device; and a bleed-out suppression unit that suppresses bleed-out generated in the side profile of the bare chip due to light passing around the bare chip among the light reflected by the reflecting surface of one of the pair of mirrors. 本发明提供安装装置及半导体器件的制造方法。提供能够提高元件的侧面的异常检查的精度的技术。安装装置具备：镜子，其以相对置的方式设置有至少一对；拍摄装置，其以裸芯片及所述镜子的反射面位于视场内的方式设置；照明装置，其沿着所述拍摄装置的光学轴照射照明光；和渗出抑制单元，其抑制由利用所述一对镜子中的一个镜子的反射面反射的光中的在所述裸芯片的周围通过的光导致的、在所述裸芯片的侧面轮廓产生的渗出。