METHOD FOR MANUFACTURING LAMINATE INCLUDING CONDUCTIVE PATTERN AND METHOD FOR MANUFACTURING TOUCH PANEL

Provided is a method for producing a laminate including a conductive pattern, which is capable of forming a conductive pattern having few defects. A method for manufacturing a laminate including a conductive pattern includes: a step for preparing a base material having a seed layer; a step for formi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	ARIDOMI TAKASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a method for producing a laminate including a conductive pattern, which is capable of forming a conductive pattern having few defects. A method for manufacturing a laminate including a conductive pattern includes: a step for preparing a base material having a seed layer; a step for forming a first photosensitive composition layer on one surface of the substrate; a step for forming a first resist pattern by exposing the first resist pattern to light and developing the first resist pattern with a first developer; a step for forming a second photosensitive composition layer on the other surface of the substrate; a step for forming a second resist pattern by exposing the second resist pattern to light and developing the second resist pattern with a second developer; a step for forming a metal pattern by plating the seed layer in a region where the first and second resist patterns are not disposed; a step for removing the resist pattern from the laminate; and a step of removing the exposed seed layer a