Double-sided grinding apparatus with convex polygonal abrasive components

The invention discloses a method and apparatus for simultaneous double-sided grinding of semiconductor structures. The double-sided grinding apparatus may include first and second grinding wheels, each having an abrasive member shaped into a convex polygon (e.g., a convex pentagon). 本发明公开用于同时双面研磨半导体...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE MIN-GYU, LI BINGZHE, LEE JAE-HOON, KWON HYO-SIK, KIM JONG-SUN, CHOI CHEOLWON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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