Double-sided grinding apparatus with convex polygonal abrasive components

Double-sided grinding apparatus with convex polygonal abrasive components

The invention discloses a method and apparatus for simultaneous double-sided grinding of semiconductor structures. The double-sided grinding apparatus may include first and second grinding wheels, each having an abrasive member shaped into a convex polygon (e.g., a convex pentagon). 本发明公开用于同时双面研磨半导体...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE MIN-GYU, LI BINGZHE, LEE JAE-HOON, KWON HYO-SIK, KIM JONG-SUN, CHOI CHEOLWON
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Beschreibung
Zusammenfassung:The invention discloses a method and apparatus for simultaneous double-sided grinding of semiconductor structures. The double-sided grinding apparatus may include first and second grinding wheels, each having an abrasive member shaped into a convex polygon (e.g., a convex pentagon). 本发明公开用于同时双面研磨半导体结构的方法及设备。所述双面研磨设备可包含第一及第二磨轮，每一磨轮具有经塑形为凸多边形(例如，凸五边形)的磨料部件。