Bluetooth earphone with heat dissipation structure

The invention belongs to the technical field of Bluetooth earphones, and particularly relates to a Bluetooth earphone with a heat dissipation structure, the Bluetooth earphone comprises a neck ring and two Bluetooth earphone bodies, a heat conduction mounting plate is fixedly arranged in each Blueto...

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Hauptverfasser: RUAN PENGFEI, WANG JUNYU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention belongs to the technical field of Bluetooth earphones, and particularly relates to a Bluetooth earphone with a heat dissipation structure, the Bluetooth earphone comprises a neck ring and two Bluetooth earphone bodies, a heat conduction mounting plate is fixedly arranged in each Bluetooth earphone body, and the side wall of each heat conduction mounting plate is fixedly connected with a plurality of heat dissipation fins. According to the invention, active heat dissipation compensation can be carried out based on whether the Bluetooth headset consumes power during working or not, efficient automatic heat dissipation operation is carried out on the Bluetooth headset, the Bluetooth headset is ensured to be in a stable working environment, the Bluetooth headset can be used while being charged, the operability of actual use is higher, and the service life of the Bluetooth headset is prolonged. Further heat dissipation compensation can be carried out based on the charging state, heat generated when t