Partitioned overlapping copper bonding interposer

The invention relates to a partitioned overlapping copper bonding interposer. An interposer and an integrated circuit including the interposer have a lower surface adapted for bump mounting and an upper surface adapted for copper bonding. The interposer layer includes an active interposer and a passive interposer. A bridge connects the interposers in the interposer layer to produce a functionally large interposer from a smaller interposer die. A core may overlap with more than one interposer in the interposer layer. An active interposer is disposed around an edge of the core while a passive interposer is below the core to facilitate heat dissipation. 本发明涉及分区重叠铜接合中介板。一种中介板及包含中介板的集成电路具有适于凸块安装的下表面及适于铜接合的上表面。中介板层包含有源中介板及无源中介板。桥接器连接所述中介板层中的中介板，以从较小的中介板裸片产生功能上大的中介板。核心可与所述中介板层中的多于一个中介板重叠。有源中介板安置在所述核心的边缘周围，而无源中介板在所述核心的下方以促进散热。