SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

A semiconductor device includes a single row of first row leads and a first chip carrier including a first electrically insulating layer disposed on the single row of first row leads. At least one first semiconductor chip is mounted on the first electrically insulating layer, where the at least one first semiconductor chip is disposed only over the single row of first row leads. 一种半导体装置包括单排第一排引线和包括布置在所述单排第一排引线上的第一电绝缘层的第一芯片载体。至少一个第一半导体芯片安装在第一电绝缘层上，其中，所述至少一个第一半导体芯片仅布置在所述单排第一排引线上方。