LED die bonding connection device

An LED die bonding connection device provided by the present invention comprises a rack, a conveying assembly, a processing platform, a pushing assembly and a manipulator assembly, the conveying assembly is installed on the rack, the conveying assembly is used for conveying a substrate, the processing platform is installed on the rack, the processing platform comprises a processing area and a discharging area which are adjacently arranged, the processing area is used for placing the substrate to facilitate processing, and the pushing assembly is used for pushing the substrate to move. The discharging area is used for containing the machined substrates, the pushing assembly is installed on the rack and used for pushing the substrates machined in the machining area to the discharging area, and the mechanical arm assembly is installed on the rack and used for pushing the substrates machined in the machining area to the discharging area. And the manipulator assembly is used for transporting the unprocessed substr